LASER-DIODE FABRICATION: Alignment and etching techniques assist ..
After completion of wafer-level testing, the edge-emitting-laser (EEL) devices need to be separated into chips ("singulated") and individually packaged.. The center of the waveguide is located about 3..0 µm above the floor of the CAIBE etch, and typical vertical beam divergence is about 40° FWHM (see Fig.. 2)..